SHENZHEN HONG YE JIE TECHONOLOGY CO., LTD.
manufacturer of bricks, iberglass composite mat, molding rubber silicone, rtv rubber silicone, Printing Silicone Rubbe, Manufacturer and Supplier - China
Electronic Potting Silicone Rubber (HY-9055)
3. Technical Guidelines of of Electronic Potting Silicone Rubber
a, Pls put part A and part B in separate container and stir evenly before mixing the two part together.
b, Mixing Ratio: part A: part B = 1:1
c, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixture could be used for pouring.
Note: The thickness of the silicone affects the curing time. If the silicone used is a little thick,then the curing time will be a little longer.The temperature also affects the curing time.When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. With temperature of 80～100℃, the silicone will cure in 15 minutes; while in 25℃ room temperature, the silicone will cure around 8 hours.
4.Notes of Electronic Potting Silicone Rubber
a.The following material may hinder the curing of HY-9055, So pls use after the test. When necessary, pls clean the application areas.
Organotin compound or Condensation silicone with organotin
Sulphur, sulfide and sulfur rubber materials.
Amine compounds as well as contains the amine materials.
Pewters solder flux
b. HY-9055 should be sealed storage.The mixture should be used up disposably to avoid causing waste.
c. HY-9055 belongs to non-dangerous goods, but keep away from mouth and eyes.
d. When it gets stratified after a period of storage, Please mix it evenly before using,which does not affect the performance.
Technical Parameters of of Electronic Potting Silicone Rubber
Features Part A Part B
Before Curing Appearence Gray Fluid White Fluid
Viscosisty（25℃cps） 2500±500 2500±500
Operation features Mixing Ratio 1：1
Viscosisty(after mixing) （cps） 2000～3000
Operating Time（25℃??hr） 120
Curing time （min，25℃） 480
Curing time（80℃??hr） 20
After Curing Hardness（Shore??A） 55±5
Thermal conductivity [W（m·K）] ?0.8
Dielectric Strength（KV/mm） ?25
Volume Resisivity（Ω·cm） ?1.0×1016
linear expansibility [m/（m·K）] ?2.2×10-4
Fire Resistance??? 94-